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ISO 4825-1:2023

Current Revision

Fine ceramics (advanced ceramics, advanced technical ceramics) --Test method for thermal property measurements of metalized ceramic substrates - Part 1: Evaluation of thermal resistance for use in power modules

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This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.


SDO ISO: International Organization for Standardization
Document Number ISO 4825
Publication Date Not Available
Language en - English
Page Count
Revision Level
Supercedes
Committee ISO/TC 206
Publish Date Document Id Type View
Not Available ISO 4825-1:2023 Revision