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ASTM F584-87(2005)

Current Reaffirmation

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015)

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1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.

1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.

1.3 Photographs (Figs. X1-X1.5 ) are included in Appendix X1 as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.


SDO ASTM: ASTM International
Document Number F584
Publication Date May 1, 2005
Language en - English
Page Count 7
Revision Level 87(2005)
Supercedes
Committee F01.07
Publish Date Document Id Type View
Jan. 1, 2006 F0584-06E01 Revision
Jan. 1, 2006 F0584-06 Revision
May 1, 2005 F0584-87R05 Reaffirmation
June 10, 1999 F0584-87R99 Reaffirmation