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ASTM F1238-95(2011)

Current Revision

Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications (Withdrawn 2020)

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1.1 This specification covers sputtering targets fabricated from metallic silicides (molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide). These targets are referred to as refractory silicide targets, and are intended for use in microelectronic applications.

1.2 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.


This specification covers refractory silicide sputtering targets for use in microelectronic applications. Targets shall be classified by the following major constituents: molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide. Target composition shall be stated as the atomic ratio of silicon to metal and shall conform to the prescribed maximum impurity level for: alkalis (potassium, lithium, sodium), refractory metals (molybdenum, tantalum, titanium, and tungsten), iron, other metals (aluminum, boron, calcium, cobalt, chromium, copper, magnesium, manganese, and nickel), carbon, and oxygen. Low alpha grade targets shall contain the prescribed maximum impurity level of uranium and thorium Dimensional and physical properties such as relative, actual, and theoretical densities are specified. The actual target density shall be determined by Archimedes principle or other acceptable techniques and the theoretical density shall be calculated from the given formula. The following chemical analytical methods shall be used: atomic absorption, combustion or infrared spectrometry, inert gas fusion, and alpha-emission rate analysis, depending on the impurity to be analyzed. There shall be no radial cracks, other cracks, or chips on the sputtering surface.


SDO ASTM: ASTM International
Document Number F1238
Publication Date June 1, 2011
Language en - English
Page Count 3
Revision Level 95(2011)
Supercedes
Committee F01.17
Publish Date Document Id Type View
June 1, 2011 F1238-95R11 Revision
Dec. 10, 1999 F1238-95R03 Reaffirmation
Dec. 10, 1999 F1238-95R99 Reaffirmation