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ASTM F1211-89(1994)e1

Current Reaffirmation

Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)

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1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies.

1.2 This specification establishes the nominal passivation opening dimensions, nominal passivation, opening spacing, nominal corner passivation opening offset, minimum scribe guard and minimum die size for the most common input/ output counts within each technology.

1.3 This specification is extendable to other interconnection technologies if the passivation opening and spacing are adjusted in such a way that the progression is not modified.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.


SDO ASTM: ASTM International
Document Number F1211
Publication Date Jan. 1, 2001
Language en - English
Page Count 3
Revision Level 89(1994)e1
Supercedes
Committee F01.16
Publish Date Document Id Type View
Jan. 1, 2001 F1211-89R01 Revision
Jan. 1, 2001 F1211-89R94E01 Reaffirmation