Logo

ASTM E1161-03

Historical Revision

Standard Practice for Radiologic Examination of Semiconductors and Electronic Components

$73.00

$73.00

$131.40


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


...

1.1 This test method provides a standard procedure for nondestructive radiographic examination of semiconductor devices, electronic components, and the materials used for construction of these items. This test method covers the radiographic examination of these items for possible defective conditions such as extraneous material within the sealed case, improper internal connections, voids in materials used for element mounting, or the sealing glass, or physical damage.

1.2 The quality level and acceptance criteria for the specimens being examined shall be specified in the detail drawing, purchase order or contract.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.


This test method is useful for determination of voiding in semiconductor element to header mounting material, glass seal, and lid seal areas. It is also useful for examination of the internal cavities of devices for extraneous material, wire dress, and bond placement for unattached elements.

SDO ASTM: ASTM International
Document Number E1161
Publication Date June 10, 2003
Language en - English
Page Count 4
Revision Level 03
Supercedes
Committee E07.01
Publish Date Document Id Type View
June 1, 2021 E1161-21 Revision
June 1, 2009 E1161-09 Revision
June 10, 2003 E1161-03 Revision
Jan. 1, 1995 E1161-95 Revision
June 1, 2014 E1161-09R14 Reaffirmation