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ASTM B490-92(1998)

Historical Reaffirmation

Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits

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1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils.

1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility.

1.3 The obtained ductility values must only be considered semi-quantitative because this test has a significant operator dependence.

1.4 This practice is best used for in-house process control where measurements are always made by the same operator. A change in ductility value can be used as an indication of possible changes in the electroplating solution.

1.5 This standard does not purport to address the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.


SDO ASTM: ASTM International
Document Number B490
Publication Date Nov. 10, 1998
Language en - English
Page Count 2
Revision Level 92(1998)
Supercedes
Committee B08.10
Publish Date Document Id Type View
April 15, 2009 B0490-09 Revision
April 1, 2021 B0490-09R21 Reaffirmation
May 1, 2014 B0490-09R14 Reaffirmation
April 1, 2008 B0490-92R08E01 Reaffirmation
Oct. 1, 2003 B0490-92R03 Reaffirmation
Nov. 10, 1998 B0490-92R98 Reaffirmation